Taiwan’s TSMC raises $3.5 billion in bonds for new U.S. plant -Breaking
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© Reuters. FILE PHOTO – The Taiwan Semiconductor Manufacturing Co. (TSMC), logo is pictured in its Hsinchu headquarters on January 19, 2021. REUTERS/Ann WangTAIPEI, Reuters – According to a term sheet, Taiwanese chip company TSMC raised $3.5 billion in bonds to finance its Arizona plant.
Taiwan Semiconductor Manufacturing Co Ltd (NASDAQ:), a leading Apple Inc (NASDAQ;) supplier, began construction in Arizona last year. The company plans to spend $12 million to construct a computer chip factory.
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